MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617073263 A) filed by Nippon Steel Corporation on June 12, 2026, for Copper-Plated Steel Sheet.
Inventors include Nakano, Tadashi; Ueda, Koichiro; Goto, Yasuto; and Tokuda, Kohei.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A copper-plated steel sheet 10 comprises: a base steel plate 20; and a dendritic copper plating film 30 formed on at least one surface of the base steel plate 20. When the copper-plated steel sheet 10 is immersed in 0.5 mass% dilute sulfuric acid at 25°C for 5 seconds, and is subsequently washed with water and dried, the lightness L* of the copper plating film 30 measured within one hour after drying is 50-71.
Disclaimer: Curated by HT Syndication.
