MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617073266 A) filed by Nippon Steel Corporation on June 12, 2026, for Copper-Plated Steel Sheet.
Inventors include Nakano, Tadashi; and Ueda, Koichiro.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A copper-plated steel sheet 10 comprises a base steel sheet 20 and a copper plating film 30 formed on at least one surface of the base steel sheet 20. The copper plating film 30 continuously covers the base steel sheet 20 at a thickness of 1.0 µm or more when viewed in a cross section parallel to the thickness direction, and has at least 25 protrusions 31 having a height of 1.0 µm or more per 1000 µm.
Disclaimer: Curated by HT Syndication.
