MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617071611 A) filed by Lifetech Scientific Shenzhen Co. , Ltd. on June 09, 2026, for Covered Stent And Delivery System.
Inventors include Chen, Erchong; and Rui, Shixuan Number.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A covered stent (100) and a delivery system (1000). The covered stent (100) comprises a covered body (10), a first wave ring (20), and a connecting portion (40). The covered body (10) comprises an end section (11) having an open end (111). The first wave ring (20) is connected to the end section (11). The connecting portion (40) is formed on at least one of the end section (11) and the first wave ring (20), and is used for being connected to a conveyor (200). An end face (112) of the end section (11) comprises a first part end face (1121) and a second part end face (1122) which are connected to each other. The first part end face (1121) and the second part end face (1122) are arranged in a circumferential direction of the covered body (10). Compared with the second part end face (1122), the first part end face (1121) protrudes in a direction away from the covered stent (100). A convex region (11a) is formed between a surface where the second part end face (1122) is located or a surface (?) where a cross section of the second part end face (1122) farthest from a main body section (12) in a direction perpendicular to an axial direction of the covered stent (100) is located and an axial direction of the first part end face (1121). The connecting portion (40) is at least partially arranged within the convex region (11a). An axial region of the connecting portion (40) is located within an axial region of the end section (11). The covered stent (100) and the delivery system (1000) can improve the wall apposition and sealing efficacy of the covered stent (100), thereby preventing endoleaks.
Disclaimer: Curated by HT Syndication.
