MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617063232 A) filed by Tcnv, LLC on May 19, 2026, for Cylindrical Brush With Varying Brush Nodule Length.
Inventors include Benson, Briant; Dobbins, Michael; Cooper, Brian; Ottman, David; and Nesmiyan, Maxim.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present invention provides a cylindrical brush assembly designed for precision cleaning of circular wafers and delicate surfaces. The brush features polyvinyl alcohol (PVA) nodules of varying lengths along one side of a cylindrical core, enabling conformity to changing gap sizes when applied at an angle to the wafer. This ensures consistent contact and uniform cleaning across the entire surface. A modular design with replaceable nodule holders allows for easy customization and maintenance. An integrated RFID tracking system embedded in the end cap monitors usage and wear levels in real time. The cleaning method involves rotating the brush at an angle relative to the wafer surface, with the nodules adapting to surface contours for optimal efficiency. While tailored for semiconductor wafer cleaning, the assembly is adaptable for other industrial applications requiring precision cleaning.
Disclaimer: Curated by HT Syndication.
