MUMBAI, India, July 30 -- Intellectual Property India has published a patent application (202641087919 A) filed by Dr. Shantharaja M; and Dr. Madhu H J on July 18, 2026, for Design Of Mechanically Actuated Cyclic Extrusion And Compression Split Die For Producing Ultrafine-Grained Materials..
Inventors include Dr. Shantharaja M; and Dr. Madhu H J.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: The present invention discloses a mechanically actuated cyclic extrusion and compression (CEC) split die for producing ultrafine-grained (UFG) materials through severe plastic deformation (SPD). The proposed split die assembly is designed to repeatedly subject metallic billets to alternate extrusion and compression cycles without causing significant changes in the overall dimensions of the workpiece, thereby enabling the accumulation of high plastic strain. The apparatus comprises a split die housing, upper and lower die segments, a mechanically driven actuation mechanism, interchangeable extrusion channels, compression plungers, billet guiding components, alignment pins, and locking arrangements that ensure precise positioning during cyclic deformation. The mechanical actuation system employs a screw- driven, hydraulic-assisted, or crank-based mechanism to generate controlled extrusion and compression forces while maintaining dimensional accuracy and repeatability. The split die configuration enables easy insertion and removal of billets, minimizes tooling wear, and facilitates processing of various metallic materials including aluminum, magnesium, titanium, copper, steels, and their alloys. The repeated cyclic extrusion and compression refine the grain structure through continuous dynamic recrystallization and dislocation accumulation, thereby significantly enhancing mechanical strength, hardness, fatigue resistance, and wear resistance while preserving adequate ductility. The invention provides a cost-effective, energy-efficient, and scalable solution for manufacturing ultrafine-grained materials suitable for aerospace, automotive, biomedical, defense, and advanced engineering applications.
Disclaimer: Curated by HT Syndication.
