MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202621075322 A) filed by Medicaps University on June 18, 2026, for Development Of Novel Polymer Compositions For Enhanced Thermal Stability In Extreme Environments.
Inventors include Prof. Ashwin Sharma; Prof. Ubaid L Hanfee; Prof. Gaurav Awasthi; Prof. Ankit Soni; Prof. Vinay Joshi; and Prof. Ashwin Parihar.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention relates to novel polymer compositions exhibiting enhanced thermal stability for operation in extreme environmental conditions. The composition comprises a thermally resistant polymer matrix selected from polyimide, polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polyamide-imide, or combinations thereof, reinforced with inorganic ceramic fillers and carbon-based nanomaterials. The inorganic fillers include silicon carbide, alumina, zirconia, boron nitride, silica nanoparticles, titanium dioxide, or combinations thereof, while the carbon nanomaterials comprise graphene nanoplatelets, carbon nanotubes, carbon nanofibers, graphite nanoparticles, or combinations thereof. The synergistic interaction between the polymer matrix, ceramic reinforcements, and nanostructured carbon materials significantly improves thermal degradation resistance, oxidation resistance, dimensional stability, heat dissipation characteristics, and retention of mechanical properties at elevated temperatures. The invention further discloses a manufacturing process involving blending, surface functionalization, melt compounding, and molding operations. The developed compositions are particularly suitable for aerospace, automotive, defense, energy, electronics, and high- temperature industrial applications requiring prolonged thermal endurance and structural reliability.
Disclaimer: Curated by HT Syndication.