MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094322 A) filed by Qualcomm Incorporated on August 04, 2026, for Device Comprising A Heat Dissipation Device With A Flexible Wick.
Inventors include Ye, Feihu; Tang, Wei; He, Hui; and Cao, Yan.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: A device comprising a first device frame; a second device frame; a first hinge coupled to the first device frame and the second device frame; a second hinge coupled to the first device frame and the second device frame; a heat dissipation device located in at least part of the first device frame, wherein the heat dissipation device includes a wick that extends to the second device frame.
Disclaimer: Curated by HT Syndication.
