MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202621064736 A) filed by Kuhltherm Private Limited on May 22, 2026, for Door-Mounted Modular Thermal Management System For Multi-Modal Cooling Of Rack-Based Computing Systems.
Inventors include Shailesh Bishnoi; Kishankumar Parashotambhai Baravaliya; Jasvipul Singh Chawla; Vishant Pankajkumar Gandhi; and Kamishbhai Dineshbhai Kachhadiya.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The invention relates to a door-integrated thermal management system for a data center rack. The system incorporates a radiator with fan assembly (2), a pump–oil-cooler–filter module (POCFM) (3), and a coolant distribution unit (CDU) (4) within a door (1) mounted to a rack through mountings (5). Facility water is supplied to each module through a facility water inlet (6) and a facility water outlet (7). Dielectric oil is circulated between the POCFM (3) and rack-mounted equipment through hoses (8, 9), and coolant is circulated through hoses (10, 11), each using universal quick disconnect couplings. The integrated configuration enables air cooling, direct liquid cooling, and immersion cooling within a single rack without requiring cooling hardware inside the rack interior, while supporting simultaneous or selective operation of multiple cooling modalities and improving serviceability.
Disclaimer: Curated by HT Syndication.
