MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641080889 A) filed by Aditya University; Aditya College Of Engineering And Technology A; Aditya College Of Pharmacy A; and Aditya Degree College on June 30, 2026, for Dough Flattening Apparatus With Integrated Flour Dispensing And Method Of Operation.
Inventors include Dr. Gowripattapu Sridevi; Mylavarapu Sarat Chandra Prasad; Gummarekula Satti Babu; Siriki Thirumala Devi; and Dr. Krishna Babu Sambaru.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The present disclosure proposes a dough flattening apparatus (100) configured to progressively flatten dough (10) to a predetermined thickness through synchronized rolling action, integrated flour dispensing, adjustable thickness regulation, and an automatic return mechanism, thereby reducing dough adhesion, minimizing manual effort, and improving consistency and efficiency during preparation of flatbread products. The dough flattening apparatus (100) comprises a base (102), a frame (112), a screw shaft (114), a crank (122), a holder (126), a pair of rollers (130), a dispenser (134), an elastic member (142), and a biased pole (144). The dough flattening apparatus (100) integrates flour dispensing, dough flattening, thickness regulation, and automatic return operation within a single coordinated mechanism to reduce manual intervention during preparation of flatbread products.
Disclaimer: Curated by HT Syndication.
