MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617090258 A) filed by Cheng, Hu on July 24, 2026, for Drainage Structure For Continuous And Uniform Negative-Pressure Conduction On All Wound Profiles.
Inventor includes Cheng, Hu.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: Disclosed is a drainage structure for continuous and uniform negative-pressure conduction on all wound profiles. The drainage structure is used in cooperation with a porous foam layer and configured for a negative pressure drainage operation, and comprises a structure body. The side of the structure body opposite to the porous foam layer is provided with a separator. The separator forms a cavity between the structure body and the porous foam layer. A through hole is formed in a position of the structure body opposite to the cavity. The through hole enables an upper space and a lower space of the structure body to communicate with each other. The present invention adopts a single-layer structure to enhance the negative pressure conduction effect, such that, when the drainage structure is applied to an uneven wound surface or a cavity gap, upper and lower layer misalignment cannot be generated in the negative pressure condition. When used in combination with a PVA material, the drainage structure provides a passage that will not dehydrate, stiffen, or collapse for the PVA material, achieves a certain moisturizing effect, and prevents the PVA material from dehydration, stiffening, or rebound resilience and permeation reduction, thus solving the blockage problems.
Disclaimer: Curated by HT Syndication.
