MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641063599 A) filed by The Principal,mepco Schlenk Engineering College on May 20, 2026, for Dual Layer Microstrip Antenna With Cross Slotted Patch And Periodic Square Spiral Metasurface Superstrate For X-Band Applications.
Inventors include Dr. R. Mercy Kingsta; Dr. R. Shantha Selvakumari; Mr. C. Karthikeyan; and Mr. G. Sriram.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The present invention cliscloses a dual-layer microstrip antenna integrated with a metasurface superstrate for enhanced X-band communication applications. The proposed antenna is designed to achieve improved bandwidth, gain, impedance matching, and radiation efficiency compared to conventional microstrip antennas. The antenna structure comprises a lower radiating layer and an upper metasurface superstrate layer separated by an optimized air gap. The lower layer includes a cross-slotted microstrip patch with parasitic resonator elements and defected ground structure (DGS) features on an FR4 epoxy substrate. The upper layer comprises a periodic 5 x 5 array of square-spiral metasurface unit cells configured to manipulate electromagnetic wave propagation in the Xcband frequency region. Elec~romagnetic coupling between the radiating patch and metasurface layer is achieved through an air gap of approximately 15 mm, thereby improving constructive wave interaction and radiation characteristics. Simulation and experimental validation demonstrated enhanced electromagnetic performance including improved bandwidth, enhanced gain characteristics, low return loss, efficient impedance matching, and high radiation efficiency. The proposed metasurface-integrated antenna provides a compact, manufacturable, and high-performance solution suitable for satellite communication, radar systems, wireless sensing, and advanced X-band communication applications.
Disclaimer: Curated by HT Syndication.
