MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202641068273 A) filed by Vellore Institute Of Technology, Chennai on May 28, 2026, for Eco-Friendly Composite For Electronic Cooling Applications And Method Of Manufacturing Thereof.
Inventors include C. K. Hemalatha; Bhuvaneshwari Mohan; Venkatachalam. G; Shenbaga Velu P; and T. Suresh.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: An eco-friendly composite for electronic cooling applications and method of manufacturing thereof is provided. The composite includes an epoxy resin matrix reinforced with a plurality of natural fibers derived from Prosopis juliflora and one or more thermally conductive fillers. The composite is suitable for manufacturing CPU cooling fans and related thermal management components. The natural fiber reinforcement enables partial replacement of conventional petroleum-based plastics, thereby reducing environmental impact and supporting sustainable material utilization. The composite enhances thermal conductivisty while maintaining excellent electrical insulation and dielectric stability. The composite is fabricated using a hand lay-up process. The composite demonstrates improved thermal conductivity, high electrical resistance and low dielectric constant, making the composite suitable for lightweight, thermally efficient and electrically safe electronic cooling applications.
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