MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202611116343 A) filed by Chandigarh University on September 29, 2026, for Electromechanical Pop-In Pop-Out Floor System For Non-Electrical Weight, Time-Location Correlation, And Load Reporting.
Inventor includes Pankaj.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention relates to an electromechanical pop-in pop-out floor system 5 for non-electrical weight, time-location correlation, and load reporting. A passive load monitoring device includes a floor-integrated surface structure, an electromechanical pop-in pop-out (EM-PIPO) sensing array, and a mechanical aggregation interface coupled to the sensing array. The sensing array includes bistable pop-in pop-out elements responsive to pressure differentials and distributed 10 across floor zones. Mechanical state transitions capture load variation, zone progression and temporal displacement without batteries, electronic sensors, wireless communication or external electrical power. A baseline load distribution can be compared with an altered distribution during handling of an object. Persistent mechanical configurations preserve load states after load removal, while the 15 mechanical aggregation interface consolidates distributed states into a load-analysis report indicating load magnitude, duration, spatial distribution, interaction frequency, cumulative load exposure or time-load correlation. The device provides power-free mechanical detection, storage and reporting of object-related load interactions.
Disclaimer: Curated by HT Syndication.
