MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617073057 A) filed by Samsung Electronics Co. , Ltd. on June 12, 2026, for Electronic Device Comprising Heat Dissipation Member.
Inventors include Kim, Boram; Kwon, Ohhyuck; Kim, Youngjin; Park, Min; Sung, Jungoh; Son, Changjong; Chang, Yoonhee Number; Jung, Jinhwan; Hwang, Jieun; Son, Jihyeon; and Yoon, Jeonggen.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present disclosure relates to an electronic device. An electronic device according to an embodiment of the present disclosure may include: a printed circuit board; a first electronic component mounted on the printed circuit board; a second electronic component arranged on a first region of the surface of the first electronic component; and a thermal reactive heat dissipation member which includes a heat dissipation material and is in contact with a second region of the surface of the first electronic component and the top surface of the second electronic component, wherein the heat dissipation member may be configured to be in a solid phase and may be configured to soften on the basis of the temperature of the heat dissipation member.
Disclaimer: Curated by HT Syndication.
