MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617092972 A) filed by Samsung Electronics Co. , Ltd. on July 31, 2026, for Electronic Device Comprising Heat Dissipation Member.
Inventors include Park, Min; Son, Jihyeon; Jung, Jinhwan; Kim, Boram; Nam, Hyungjong; Moon, Youngjoo; Yoon, Jeonggen; Lee, Kyuhwan; Lee, Haejin; Chang, Yoonhee; and Hwang, Jieun.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present disclosure relates to an electronic device. The electronic device according to one embodiment of the disclosure comprises: a first substrate including a first surface and a second surface oriented in the opposite direction of the first surface; a second substrate including a third surface facing the first surface, and a fourth surface oriented in the opposite direction of the third surface; at least one interposer arranged between the first surface and the third surface; a first electronic component arranged on the fourth surface; and a heat dissipation member which is solid at room temperature, and which is arranged in a space defined by the first substrate, the second substrate and the at least one interposer, so as to overlap the first electronic component when viewed in the direction perpendicular to the fourth surface.
Disclaimer: Curated by HT Syndication.
