MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202347049439 A) filed by Samsung Electronics Co. , Ltd. on July 21, 2023, for Electronic Device Comprising Housing Assembly Structure.
Inventors include Moon, Heecheul; Kim, Gyeongtae; and Baek, Moohyun.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: An electronic device, according to various embodiments, comprises: a first plate; a second plate; a lateral member which is disposed so as to surround a space between the first plate and the second plate, and comprises a conductive portion, and a nonconductive portion coupled to the conductive portion; a frame member which is coupled along the edges of the lateral member so as to be at least partially visible from the outside, is essentially formed into a closed loop, and forms at least a portion of the lateral surface of the electronic device; and a display which is disposed in the space so as to be visible from the outside through the first plate, wherein the frame member may be coupled to the nonconductive portion.
Disclaimer: Curated by HT Syndication.
