MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075532 A) filed by Samsung Electronics Co. , Ltd. on June 18, 2026, for Electronic Device Including Molding Portion.
Inventors include Kim, Junyoung; Choi, Byungchul; and Kim, Ilyoung.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: An electronic device according to an embodiment disclosed herein comprises: a housing; a display disposed in the housing; and a molding portion formed at an end portion of the display. The display includes: a panel layer including a bending region in at least a portion of the end portion; and a protective layer disposed on the panel layer. The protective layer includes a first recessed region in which at least a portion of an end portion of the protective layer is recessed, and the molding portion may be disposed so as to fill the first recessed region.
Disclaimer: Curated by HT Syndication.
