MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127775 A) filed by Acm Research Shanghai; Inc. on October 27, 2026, for Electroplating Chuck For Square Substrate And Electroplating Method.
Inventors include Wang, Hui; Wang, Jian; Jia, Zhaowei; Yang, Hongchao; Diao, Jianhua; and Xiao, Yan.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Provided in the present invention is an electroplating chuck for a square substrate, comprising: a substrate chuck plate, which has an inner edge for supporting a substrate; a pressing plate, which is arranged above the substrate chuck plate, wherein a guide post is provided between the substrate chuck plate and the pressing plate, the pressing plate can ascend or descend along the guide post, the bottom of the pressing plate is provided with a first reinforcement rib which is used for coming into contact with the edge of the substrate when the pressing plate presses the substrate, and the first reinforcement rib is square and has an inner side length that is less than the side length of the substrate; and at least one suction member, which is fixed on the pressing plate and is used for suctioning the substrate. The present invention effectively solves the inherent warpage problem of large-sized square substrate products, significantly improves the electroplating uniformity of the square substrates, reliably ensures both product quality and yield in continuous production, and has a simple structure and low production cost.
Disclaimer: Curated by HT Syndication.
