MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202521036430 A) filed by Vanaz Engineers Limited on April 15, 2025, for Enhanced Temperature Relief Device For Gas Cylinder Valve.
Inventors include Vispute, Suresh Jagannath; Athalaye, Alok Shirish; and Patil, Sanket Arvind.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: ABSTRACT TITLE: Enhanced temperature relief device for gas cylinder valve. The known temperature relief device suffers from a problem of premature release of gas due to physical state change of fusible alloy at lower temperature. The invention provides an improved temperature relief device design for gas cylinder to prevent premature gas release under thermal stress. It comprises a fusible plug (126) having a fusible alloy (128) inside and a filter (110) at the end part away from the cylinder body. The fusible plug (126) and the filter (110) are made up from same or different materials having melting point higher than the melting point of the fusible alloy (128). The filter (110) is between the fusible alloy (128) and the gas escape vent of the fusible plug (126). It permits the escape of fully molten fusible alloy by restricting the semi solid fusible alloy and thereby preventing early release of gas before achieving threshold temperature range. Refer
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