MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202527107250 A) filed by Sig Services AG on November 05, 2025, for Film For Flexible Packaging.
Inventor includes Bernal-Lara, Teresa.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: A film for flexible packaging having a cap layer, a core layer and a seal layer that are laminated together. The cap layer has a first side and a second side. The core layer has a first side and a second side. The second side of the cap layer is positioned to overlie the first side of the core layer and is laminated thereto. The seal layer has a first side and a second side. The second side of the core layer is positioned to overlie the first side of the seal layer and is laminated thereto. One of the cap layer and the core layer comprises a biaxially oriented polyamide. And, one of the cap layer and the seal layer comprises a blown film comprising polyethylene having a compatibilizer having a density of 95 g/cc.
Disclaimer: Curated by HT Syndication.
