MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641068368 A) filed by Karunya Institute Of Technology And Sciences; and Thermal Systems Group U. R. Rao Satellite Centre Isro on June 01, 2026, for Flexible Heat Pipe With A Stepped Multi-Layered Wick Structure.
Inventors include Dr. A Brusly Solomon; Nidhin A R; R. Jayaseelan; Akhil Jaiswal; Devaraju G; Dr. Anand A R; and Dr. Venkata Raghavendra.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present invention relates to a flexible heat pipe (100), comprising a sealed enclosure having an evaporator section (10), an adiabatic section (12), and a condenser section (14); flexible bellows (16) in the adiabatic section (12); and a capillary wick structure (18) disposed along an inner surface of the enclosure, characterised in that, the wick structure is a stepped multi-layered configuration in which wick thickness varies in discrete axial steps along the longitudinal axis of the heat pipe (100), the stepped multi-layered wick structure includes an adiabatic zone (20) having a wick thickness of 3t1; a transition zone (22) having a wick thickness of 2t1; and a terminal zone (24) having a wick thickness of t1. The wick thickness is maximum in the adiabatic section and decreases in discrete steps towards the ends of the evaporator section and the condenser section.
Disclaimer: Curated by HT Syndication.
