MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202611016427 A) filed by Sudhir Srivastava Innovations Private on February 13, 2026, for Flexible Printed Circuit Board With Separate Data And Power Paths With Controlled Impedance And Ground Reference.
Inventors include Srivastava, Sudhir Prem; Srivastava, Vishwajyoti Pascual; Chopdar, Suryanshu Sundar; Misra, Tanay; and Budda, Rajesh.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A flexible printed circuit board (PCB) (400, 301) is disclosed for use in motion-intensive electromechanical systems, including robotic arm assemblies (200). The flexible PCB (400, 301) comprises a polyimide substrate (401) supporting at least one power path (403), a pair of differential signal paths (405a, 405b), and a ground reference path (407). The power path (403) is routed along a first geometric path and is spatially separated from the differential signal paths (405a, 405b) routed along a second geometric path to minimize crosstalk. The differential signal paths (405a, 405b) are routed adjacent to the ground reference path (407) to maintain a controlled characteristic impedance of about 100 ohms ±10% during static and dynamic operation. The flexible PCB (301) is configured to route through articulated joints and pulley regions of a robotic arm assembly (200) while maintaining electrical integrity during repeated bending and motion. Fig. 4
Disclaimer: Curated by HT Syndication.
