MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202641109451 A) filed by Sathyabama Institute Of Science And Technology Deemed To Be University on September 11, 2026, for Food Packet Resealing Device.
Inventor includes Shamini G I.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: A food packet resealing device, comprising a housing 101 housing 101 defining a sealing chamber 105a for receiving an open end of a food packet, a material detection sensor and configured to identify a material type of the food packet, a thermal sealing module 102 installed in the housing 101 and comprising a heating element 102a adapted to apply heat to seal the food packet, a mechanical sealing module 103 and comprising a stapling unit 103a mounted on an articulated arm 103b configured to apply a staple to seal the food packet, and a microcontroller communicatively coupled to the material detection sensor, the thermal sealing module 102, and the mechanical sealing module 103, wherein the microcontroller is configured to select and activate one of the thermal sealing module 102 or the mechanical sealing module 103 based on the material type identified by the material detection sensor.
Disclaimer: Curated by HT Syndication.
