MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202611104459 A) filed by Dr. Mukesh Kumar Singh; Mr. Nitypal Singh Chouhan; Dr. Rohini Armo; Ms. Deepika Singh; Mr. Dheeraj Kumar; Mr. Mukesh Thakur; Mr. Aphroz Ansari; Ms. Ramsheela; Mr. Priyanshu Tribhuwan Upadhyay; and Mr. Prashant Kumar on August 31, 2026, for Formulation And Evaluation Of Amodaiquin Transdermal Patch For The Treatment Of Rheumatoid Arthritis.
Inventors include Dr. Mukesh Kumar Singh; Mr. Nitypal Singh Chouhan; Dr. Rohini Armo; Ms. Deepika Singh; Mr. Dheeraj Kumar; Mr. Mukesh Thakur; Mr. Aphroz Ansari; Ms. Ramsheela; Mr. Priyanshu Tribhuwan Upadhyay; and Mr. Prashant Kumar.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: The present invention relates to a transdermal drug delivery system comprising amodiaquine-loaded matrix-type transdermal patches for the treatment of rheumatoid arthritis. The patches are prepared by solvent casting technique using hydroxypropyl methylcellulose and ethyl cellulose as polymeric matrices with polyethylene glycol 400 as plasticizer in an ethanol-chloroform solvent system. Six formulations were developed and evaluated for physical appearance, thickness, folding endurance, weight uniformity, moisture content, moisture uptake, drug content uniformity and in vitro drug release. The optimized formulation F3, comprising 100 mg amodiaquine with 1.5 grams HPMC and 225 mg PEG 400, demonstrated a thickness of 0.70 mm, folding endurance of 392.6 folds, moisture content of 2.66 percent, drug content of 96.5 percent, and controlled cumulative drug release of 65 percent over 8 hours. The invention provides a non-invasive transdermal delivery platform exploiting the anti-inflammatory and immunomodulatory properties of amodiaquine for rheumatoid arthritis management.
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