Intellectual Property India Publishes Patent Application for General-Purpose Memory Die And Near-Memory Compute Die Concurrently In System-In-Package

MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202647094715 A) filed by Qualcomm Incorporated on August 05, 2026, for General-Purpose Memory Die And Near-Memory Compute Die Concurrently In System-In-Package.

Inventors include Badaroglu, Mustafa; Wang, Zhongze; Chidambaram, Periannan; Chen, Roawen; and Kang, Woo Tag.

The application for the patent was published on August 14, 2026, under issue no. 33/2026.

Abstract: A system-in-package (SIP) is described. The SIP includes a general-purpose memory die. The SIP also includes a near-memory compute die. The SIP further includes an inter-space filler in between the general-purpose memory die and the near-memory compute die.

Disclaimer: Curated by HT Syndication.