MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617098010 A) filed by Corning Incorporated on August 13, 2026, for Glass Containers With Increased Bottom Thickness.
Inventors include Demartino, Steven Edward; and Webb, James Ernest.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present application is directed to glass containers with increased bottom thickness. The glass containers disclosed herein have a bottom with an increased thickness compared to conventional glass containers. Due to the thermal insulating properties of glass, the greater thickness of the bottom of the glass vials slows down the heat transfer rate through the bottom so that the heat transfer rate through the bottom of the glass vial is the same as or less than the heat transfer rate through the sidewalls of the glass vial. This in turn provides for more even cooling of the contents of the glass vial, which results in formation of smaller crystals during crystallization and reduces concentration gradients throughout the composition.
Disclaimer: Curated by HT Syndication.
