MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617057769 A) filed by Pregis LLC on May 06, 2026, for Heat-Activated Multilayer Embossment.
Inventor includes Wetsch, Thomas D..
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Multi-layer packaging articles can include embossments formed on each layer. A bonding element fixes the embossments on one layer to corresponding embossments on another layer. The bonding element can be a heat-activatable material, including a thermoplastic material. The bonding element can have a stability that permits the bonding element to retain its ability to form a satisfactory bond after being exposed to the ambient environment in an un-activated state.
Disclaimer: Curated by HT Syndication.
