MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202544114483 A) filed by Progress Y&y Corp. on November 20, 2025, for Heat Bonding Machine.
Inventor includes Chi, Ming-.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: A heat bonding machine is configured to hot press a circuit board to be welded, and the heat bonding machine has a hot bar welding head device (10), a pressure sensor (20), and an adjustment device (30). The hot bar welding head device (10) has a hot bar head (12) and a temperature feedback wire (14). The hot bar head (12) may abut the circuit board. The temperature feedback wire (14) is configured to measure a temperature of the hot bar head (12). The pressure sensor (20) is mounted on the hot bar welding head device (10) and may sense a pressure of the hot bar welding head device (10) in contact with the circuit board. The adjustment device (30) is connected to the pressure sensor (20), and the adjustment device (30) adjusts a distance and the pressure between the hot bar welding head device (10) and the circuit board according to the pressure sensed by the pressure sensor (20).
Disclaimer: Curated by HT Syndication.
