MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617093139 A) filed by Diehl Metal Applications Gmbh on July 31, 2026, for Heat Pipe And Method Of Fitting A Heat Pipe.
Inventor includes Springborn, Martin.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention relates to a heat pipe (1) for a preferably electric or electronic arrangement (2), preferably in the form of a printed circuit board, comprising an elongate, hermetically sealed hollow body (101), preferably in the form of a hermetically sealed tube, wherein a heat transport medium (112) is located in the interior of the hollow body (101). The heat pipe (1) also comprises at least one stamp region (103, 104) which narrows the cross section of the hollow body (101), wherein the stamp region (103, 104) forms an anchoring base for at least one contact pin (105), preferably for a group of contact pins (105).
Disclaimer: Curated by HT Syndication.
