MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202621015510 A) filed by Solanki Vijaykumar Hargovandas on February 12, 2026, for High-Conductivity Corrosion-Resistant Copper-Based Alloy Compositions And Method Of Manufacturing Wire And Microstrip Therefrom.
Inventor includes Solanki Vijaykumar Hargovandas.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: An integrated metallurgical system and method for producing high-conductivity copper-alloy wires and microstrips exhibiting intrinsic corrosion re-sistance without precious metal coatings. The system comprises coordinated melting, casting, thermomechanical processing, and passivation modules em-ploying induction furnaces with interchangeable crucibles, electromagnetic stir-ring, vacuum degassing, continuous or ingot casting with controlled solidifica-tion, multi-stage drawing or rolling with in-line laser diameter and tension moni-toring, and controlled-atmosphere heat treatment. Three copper-based alloy formulations are disclosed: a Cu-Cr-Zr-Si conductor alloy achieving 92-98% IACS conductivity, a Cu-Fe-Co-Si-Ce marine alloy with cerium oxysulfide sul-phide-blocking capability at 85-92% IACS, and a Cu- Ti-Mg-Zr ultra-fine wire alloy with anti-carbonization titanium dioxide surface layers at 88-96% IACS. Thermal passivation at 180-300°C develops self-healing nanometric oxide ar-chitectures providing corrosion current densities below 0.1 uA/cm2 and contact resistance below 5 milliohms, enabling replacement of gold-plated conductors in electronic, renewable energy, and marine applications at substantially re-duced cost.
Disclaimer: Curated by HT Syndication.
