MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617099202 A) filed by Hsp Hochspannungsgerte Gmbh on August 17, 2026, for High-Voltage Apparatus.
Inventors include Lider, Paul; Heil, Bernhard; Loeffler, Ulrich; Bauer, Christian; and Hertzel, Benjamin.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Proposed is a high-voltage apparatus (1) having: an insulating body (20); an inner conductor (10) which is guided through the insulating body (20) in an axial direction; a padding layer (30) which is made of an electrically non-conductive material, is arranged between the inner conductor (10) and the insulating body (20), extends concentrically around the inner conductor (10) and has a through-opening (31) in a radial direction; and a contacting device (40) which is arranged at least in part in the through-opening (31) of the padding layer (30) and is designed to lead an electrically conductive connection from the inner conductor (10) through the padding layer (30) to the insulating body (20). The contacting device (40) has a flexible, conductive filling (41) which is arranged in the through-opening (31) of the padding layer (30).
Disclaimer: Curated by HT Syndication.
