MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617073256 A) filed by Nippon Steel Corporation on June 12, 2026, for Hot Dipped Steel Material.
Inventors include Tokuda Kohei; Goto Yasuto; Saito Mamoru Number; Ishii Kotaro; and Uranaka Masaaki.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: This hot dipped steel material has a plating layer that has a desired average chemical composition. When the distance from the surface of the plating layer to the interface between the base steel material and the plating layer is defined as the thickness t of the plating layer, a region in which the total amount SA of Cr and Mo is 0.05 mass% or more is present continuously in the thickness direction of the base steel material by 1.0 µm or more in a region from a thickness position of 0.1 × t from the surface of the plating layer to a thickness position at which an Fe concentration that is equal to 40% of the Fe concentration of the base steel material is detected.
Disclaimer: Curated by HT Syndication.
