MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202441102012 A) filed by Stellantis Auto Sas; and Fca Us LLC on December 23, 2024, for Housing Assembly For Printed Circuit Board.
Inventors include Manish Kumar; Ravinder Singh; Shivaprasada Kv; and Jerome Forest.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: HOUSING ASSEMBLY FOR PRINTED CIRCUIT BOARD A housing assembly (1) for a printed circuit board (50) having at least one antenna mounted on comprising an upper housing (10) including at least one first cutout (11), a lower housing including at least one second cutout (22) and a cover (30) fastened to the housing assembly (1) for appropriately sealing an opening (51) formed by the first cutout (11) and the second cutout (22) to protect the printed circuit board and antennas from ingress. The cover (30) having a front portion (34) fastened to the opening (51) around the second cutout (22) and a top portion (33) fastened to the opening (51) around the first cutouts (11). The front portion (34) is fastened to the lower housing (20) in sliding fit manner and the top portion (33) is fastened to the upper housing (10) in snug fit manner. [Figure 1]
Disclaimer: Curated by HT Syndication.
