MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202647089142 A) filed by Qualcomm Incorporated on July 22, 2026, for Integrated Device With Conductive Pillar Structure For Die Interconnection.
Inventors include We, Hong Bok; Buot, Joan Rey Villarba; Kang, Kuiwon; and Bchir, Omar James.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: A device includes a substrate that includes a set of metal layers, separated from one another by a set of dielectric layers. The set of metal layers define a first set of metal lines and a second set of metal lines. The substrate includes a first set of conductive pillars configured to be electrically connected to a first die, and a second set of conductive pillars interconnecting the first set of metal lines to the first set of conductive pillars. The substrate also includes a first set of pads configured to be electrically connected to the first die, and a first set of conductive vias interconnecting the second set of metal lines to the first set of pads. The first set of conductive pillars extend from a surface of the substrate.
Disclaimer: Curated by HT Syndication.
