MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202415056730 A) filed by Apple Inc. on July 25, 2024, for Integrated Gan Power Module.
Inventors include Sahoo, Ashish K.; Pierquet, Brandon; Davis, Derryk C.; Ruiz, Javier; and Brock, John M..
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heattransfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.
Disclaimer: Curated by HT Syndication.
