MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647071540 A) filed by Hewlett-Packard Development Company, L. P. on June 09, 2026, for Interposer For A System-On-Chip Cooling Device.
Inventors include Chen, Chien-Hua; and Cumbie, Michael W..
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: A method of assembling a cooling device includes forming an interposer by plating a metallic material on a carrier to form a first metallic trace, forming a first layer of nonmetallic material around the first metallic trace to form a first interposer layer, and removing the first metallic trace to form a first fluid channel. The method further includes coupling a first side of the interposer to a first manifold including a second fluid channel to fluidly couple the first fluid channel to the second fluid channel.
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