MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647087249 A) filed by Senju Metal Industry Co. , Ltd. on July 16, 2026, for Jet Solder Device.
Inventors include Shinohara Katsuhiro; Kagaya Tomotake; and Kuramoto Kyoko.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A jet solder device includes a storage tank 110 for storing molten solder S, supply parts 120, 130 for supplying molten solder S, and a guide member 150 for guiding the molten solder S supplied from the supply parts 120, 130 to the molten solder S in the storage tank 110. The guide member 150 is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder S.
Disclaimer: Curated by HT Syndication.
