MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647087076 A) filed by Senju Metal Industry Co. , Ltd. on July 16, 2026, for Jet Soldering Apparatus.
Inventors include Ichikawa Hirokazu; Kagaya Tomotake; Ozawa Satoshi; and Kuramoto Kyoko.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: This jet soldering apparatus includes a storage tank 110 for storing molten solder S, and a supply section 125 having a plurality of nozzles 127 for supplying the molten solder S. The height of the nozzles 127 is between 3 mm and 10 mm, inclusive.
Disclaimer: Curated by HT Syndication.
