MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617075208 A) filed by Fujifilm Corporation; and Fujifilm Electronic Materials U. S. A. , Inc. on June 17, 2026, for Kit And Method For Manufacturing Semiconductor Device.
Inventors include Kamimura Tetsuya; Mizutani Atsushi; Hu Bin; Liang Yannan Number; Sugimura Nobuaki; Huang Ting-Kai; Fan Hanyu; Li Wei; and Lee Hyosang.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: Provided are a kit including a polishing liquid and a washing liquid and a method for manufacturing a semiconductor device using the kit. The kit, when used for a treatment in which a treatment target is subjected to chemical mechanical polishing and the treatment target subjected to chemical mechanical polishing is further washed, can suppress the occurrence of scratches on the treatment target surface and leaves less organic residues on the treatment target surface. The kit for use in subjecting a treatment target to chemical mechanical polishing and further washing the treatment target subjected to chemical mechanical polishing includes a polishing liquid and a washing liquid. The polishing liquid includes an abrasive grain, a nonionic surfactant, and a specific azole compound selected from the group consisting of benzotriazole and derivatives thereof and has a pH of 7.0 or more, and the washing liquid includes an amine compound.
Disclaimer: Curated by HT Syndication.
