MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202627050879 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on April 21, 2026, for Lead-Out Structure And Magnetic Latching Relay.
Inventors include Dai, Wenguang; Liao, Guojin; and Zhong, Shuming.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Provided in the embodiments of the present disclosure are a lead-out structure and a magnetic latching relay. The lead-out structure comprises a lead-out member and at least one auxiliary member. The lead-out member comprises a first lead-out portion and a second lead-out portion, wherein one end of the second lead-out member is connected to one side of the first lead-out portion; in the direction of width of the lead-out member, the width of the second lead-out portion is less than the width of the first lead-out portion; the first lead-out portion is configured to electrically connect to a static spring portion of a relay; and the at least one auxiliary member is fixedly connected to the second lead-out portion. The lead-out member is formed by means of a stamping process, and the auxiliary member is formed using the remaining material after forming the lead-out member by means of the stamping process. The lead-out structure of the present disclosure enables the preparation process to be simplified, allows a load circuit to have a reduced impedance, and has an increased current-carrying area which helps reduce temperature rise, while also saving on materials and reducing costs.
Disclaimer: Curated by HT Syndication.
