MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202617053077 A) filed by Sartorius Stedim Aseptics on April 25, 2026, for Leaktight Assembly And Method For Manufacturing The Same.
Inventors include Mendik, Nicolas; and Vignau, Thomas.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The invention relates to a Leaktight assembly comprising: - A bag (1) comprising a wall (8) of flexible film, - a connection system (9) comprising a connector (21) adapted to be mechanically connected to a complementary connector of a sterile enclosure (11) for sterile communication between the bag (1) and the enclosure (11), the connector (21) comprising a portion for attachment to the bag (210), the connection system (9) further comprising an overmolding (40) overmolded on the attachment portion (210), the wall of the bag (1) being welded to the overmolding (40) in a continuous closed manner along a predetermined portion of the wall of the bag (1), and - a protective envelope (15) of the connection system (9), comprising a wall of flexible film, the wall of the protective envelope (15) being welded on said connection system (9) in a continuous closed manner along a predetermined portion of the wall of the protective envelope (15).
Disclaimer: Curated by HT Syndication.
