MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202647089215 A) filed by Qualcomm Incorporated on July 22, 2026, for Lid Through Interposer Of Semiconductor Package For Thermal Management.
Inventors include Chen, Yujen; Patil, Aniket; Sun, Yangyang; and Yan, Bohan.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: Disclosed are semiconductor packages in which a heat producing die, such as a system-on-chip (SoC) die is encapsulated in a mold between a substrate and an interposer. To help dissipate heat generated by the die, a thermally conductive lid is formed to conduct heat from the die. The lid is formed through the interposer to where it can be thermally coupled with a heat sink. In this way, the heat from the die can be conducted away.
Disclaimer: Curated by HT Syndication.
