MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617070581 A) filed by Emitec Technologies Gmbh on June 05, 2026, for Method For Applying Glue To A First Layer, And A Honeycomb Structure.
Inventors include Schmidt, Christian; Schepers, Sven; Voit, Michael; Niedmann, Alf; Hodgson, Jan; and Zaun, Sascha.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The invention relates to a method for applying glue to a first layer (1), which has a wave structure (2), wherein the first layer (1) extends along an extension direction (3) between a first end (4) and a second end (5) and transverse thereto along a width direction (6) between a first end face (7) and a second end face (8), wherein the wave structure (2) of the first layer (1) has a plurality of troughs (9) and crests (10) extending parallel to one another, which in each case extend at an angle of inclination (11) to the width direction (6) of more than zero degrees and at most 45 degrees along a progression direction. The invention also relates to a method for producing a honeycomb structure (19) having the first layer (1) to which glue was applied, and to a honeycomb structure (19).
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