MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617001399 A) filed by Sam Bu Fine Chemical Co. , Ltd.; and Park, Heedae on January 06, 2026, for Method For Manufacturing Lightweight Meltblown Hot-Melt Nonwoven Fabric Containing Hydrophobic Nanosilica.
Inventor includes Park, Heedae.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: A lightweight meltblown hot-melt nonwoven fabric containing hydrophobic nanosilica, manufactured by the manufacturing method of the present invention, when interposed between adherends such as fabrics to perform an adhesive function, has the effect of saving about 10-50% in material costs and energy while ensuring uniform adhesive strength across sections, excellent peel strength, and good air breathability, even with the application of a smaller amount of adhesive resin than conventional hot-melt films. As a result, the fabric product employing the meltblown hot-melt nonwoven fabric are characterized by the prevention of overflow during an adhesive process and by the realization of lightweight and soft hand feel.
Disclaimer: Curated by HT Syndication.
