MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093751 A) filed by Resonac Corporation on August 03, 2026, for Method For Manufacturing Substrate With Conductive Through-Via, Metal Paste, And Substrate With Conductive Through-Via.
Inventors include Ejiri Yoshinori; Sakamoto Masumi; and Shimizu Chiaki.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: Provided is a method for manufacturing a substrate with a conductive through-via, said method comprising: a step (a) of preparing a substrate provided with a hole, and providing a metal paste part containing metal particles and a volatile solvent so as to fill the inside of the hole and cover at least a surface around the hole of the substrate; a step (b) of heating the metal paste part to remove a portion of the volatile solvent; a step (c) of removing a portion of the metal paste part after heating so that the surface is exposed, thereby forming, on the inside of the hole, a conductive through-via precursor which has a flattened exposed surface and which contains a remainder of the metal particles and the volatile solvent; and a step (d) of calcining the conductive through-via precursor. The metal particles include first metal particles having a volume average particle diameter of 0.8 µm or more, and second metal particles having a volume average particle diameter of 0.5 µm or less. The metal particle concentration of the metal paste part provided in step (a) is 95.0% by mass or more. The content of the second metal particles in the metal paste part provided in step (a) is 50% by mass or less based on the total amount of the metal particles. This method for manufacturing a substrate with a conductive through-via is also useful as a technique for reducing an environmental load due to plating.
Disclaimer: Curated by HT Syndication.
