MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202631126714 A) filed by National Institute Of Technology Jamshedpur on October 23, 2026, for Method For Maskless Selective-Area Circuit Patterning On A Polyethylene Terephthalate (pet) Foil Through Electroless Deposition.
Inventors include Budhram Boipai; and Tushar Banerjee.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention generally relates to a method for maskless selective-area circuit patterning on a polyethylene terephthalate (PET) substrate. The method includes mechanically roughening the PET substrate to increase surface roughness, followed by sequential organic solvent cleaning and chemical etching using dilute hydrochloric acid at 60 °C to form surface micro-pockets. An activator solution comprising nickel ions is selectively deposited along a predetermined circuit pattern onto the etched substrate using a multi-axis fountain pen plotter. A reducing agent solution is directly applied onto the deposited pattern to reduce the nickel ions into metallic nickel catalyst seeds. Without an intermediate drying step, the wet, catalytically seeded substrate is transferred into an alkaline electroless nickel-phosphorus (Ni-P) plating bath. The process yields a continuous, high-resolution, electrically conductive Ni-P circuit pattern exhibiting low sheet resistance and an adhesion rating of 5B on the flexible PET substrate.
Disclaimer: Curated by HT Syndication.
