MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641094769 A) filed by Mohanprabu Mylsamy; R. Arunkumar; Dr. M. Naveenkumar; Karthi Poyyamozhi; Dr. S. Philip Raja; Dr. Shailendra Kumar Bohidar; and Mr. M. Sudhakar on August 05, 2026, for Microchannel Heat Exchanger With Adaptive Multi-Zone Flow Distribution For High-Density Thermal Management Applications.
Inventors include Mohanprabu Mylsamy; R. Arunkumar; Dr. M. Naveenkumar; Karthi Poyyamozhi; Dr. S. Philip Raja; Dr. Shailendra Kumar Bohidar; and Mr. M. Sudhakar.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: [062] The present invention relates to a microchannel heat exchanger with adaptive multi-zone flow distribution for high-density thermal management applications. The heat exchanger comprises segmented inlet manifolds, adaptive flow-balancing chambers, modular microchannel plates having variable hydraulic diameters, turbulence- enhancing internal microstructures, localized thermal balancing chambers, removable filtration assemblies, distributed temperature sensing units, and scalable modular construction. The adaptive coolant distribution architecture minimizes flow maldistribution, reduces pressure loss, improves heat transfer efficiency, suppresses hotspot formation, and enhances operational reliability. The invention is particularly suitable for cooling high-power electronics, electric vehicle battery systems, power converters, aerospace equipment, renewable energy systems, data centers, medical devices, telecommunications infrastructure, and other applications requiring compact, high-performance thermal management. Accompanied Drawing [FIGS. 1-2]
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