MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202521029801 A) filed by Tata Toyo Radiator Ltd on March 28, 2025, for Modified Thermostatic Expansion Valve Connector And Method For Enhancing Chiller System Performance.
Inventors include Mr. Rajiv Kulkarni; Mr. Amitav Jha; Mr. Gaurav Deshpande; and Mr. Vaisagh Pr.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: ABSTRACT MODIFIED THERMOSTATIC EXPANSION VALVE CONNECTOR AND METHOD FOR ENHANCING CHILLER SYSTEM PERFORMANCE The invention pertains to the field of chiller systems, specifically focusing on a modified thermostatic expansion valve (TXV) connector (7a) designed to enhance system performance. The TXV connector (7a) features a reduced diameter at the inlet (9) for effective refrigerant flow regulation and an extended flaring protrusion (10) to improve sealing and stability. It is engineered to maintain a pressure drop below 27 kPa and achieve a thermal output performance of at least 3.5 kW, ensuring compatibility with existing chiller components. The connector is constructed from high-strength alloys or composite materials to withstand chemical and thermal stresses. Additionally, it is designed for easy retrofitting and can replace the function of Cup Plate C (4). The manufacturing process involves precision machining or additive manufacturing techniques, offering a method to enhance chiller performance through these structural modifications (
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