MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202644007753 A) filed by Forum Us, Inc. on January 27, 2026, for Modular Cooler And Isolation Valve Assembly.
Inventors include Visscher, Kevin James; Hilton, Matthew Glenn; Penner, Jonathan Paul; Lotey, Iqbal Singh; and Godbout, Daniel Andr.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: A heat exchange system comprising an inlet manifold, an outlet manifold, and a modular cooler. The modular cooler comprises an inlet end body coupled to the inlet manifold, an outlet end body coupled to the outlet manifold, a heat exchange body fluidly coupled between the inlet end body and the outlet end body, an inlet isolation valve assembly coupled to the inlet end body and movable between an open position and a closed position, and an outlet isolation valve assembly coupled to the outlet end body and movable between an open position and a closed position. The inlet and outlet isolation valve assemblies are configured to control fluid flow between the manifolds and the end bodies.
Disclaimer: Curated by HT Syndication.
