MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202611099296 A) filed by Noida International University on August 17, 2026, for Modular Fan-Shaped Coolant Nozzle Array With Interlocking Ring Assembly.
Inventors include Pradyut Anand; Suresh Pratap; Mohit Aggarwal; and Rahul Kumar Singh.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A modular coolant nozzle array for a computer numerical control machining center comprises a plurality of coolant nozzle elements arranged collectively in a fan- shaped geometry and an interlocking ring assembly for interlocking the coolant nozzle elements. Conventional coolant-delivery arrangements commonly employ straight-tube or fixed-position configurations. The disclosed structure provides a modular arrangement in which the coolant nozzle elements are assembled through the interlocking ring assembly to establish the fan-shaped coolant nozzle array. The resulting array is configured for delivery of coolant during CNC machining operations. The structural combination provides an alternative machine-tool coolant-delivery architecture based on a modular ring-connected nozzle array rather than a conventional straight-tube arrangement. The coolant nozzle array is applicable to CNC machining centers and associated coolant-delivery systems.
Disclaimer: Curated by HT Syndication.
